The ADuM260N/ADuM261N/ADuM262N/ADuM263N are 6-channel digital isolators based on Analog Devices, Inc., iCoupler® technology. Combining high speed, complementary metal-oxide semiconductor (CMOS) and monolithic air core transformer technology, these isolation components provide outstanding performance characteristics superior to alternatives such as optocoupler devices and other integrated couplers. The maximum propagation delay is 13 ns with a pulse width distortion of less than 4.5 ns at 5 V operation. Channel to channel matching of propagation delay is tight at 4.0 ns maximum.
The ADuM260N/ADuM261N/ADuM262N/ADuM263N data channels are independent and are available in a variety of configurations with a withstand voltage rating of 5.0 kV rms (see the Ordering Guide). The devices operate with the supply voltage on either side ranging from 1.7 V to 5.5 V, providing compatibility with lower voltage systems as well as enabling voltage translation functionality across the isolation barrier.
Unlike other optocoupler alternatives, dc correctness is ensured in the absence of input logic transitions. Two different fail-safe options are available by which the outputs transition to a predetermined state when the input power supply is not applied.
**Applications**
General-purpose multichannel isolation
Serial peripheral interface (SPI)/data converter isolation
Industrial field bus isolation
### Features and Benefits
High common-mode transient immunity: 100 kV/μs
High robustness to radiated and conducted noise
Low propagation delay
13 ns maximum for 5 V operation
15 ns maximum for 1.8 V operation
150 Mbps maximum guaranteed data rate
Safety and regulatory approvals (pending)
UL recognition: 5000 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice 5A
VDE certificate of conformity
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIORM = 849 V peak
CQC certification per GB4943.1-2011
Low dynamic power consumption
1.8 V to 5 V level translation
High temperature operation: 125°C
Fail-safe high or low options
16-lead, RoHS-compliant, wide body SOIC_IC package