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Freescale Semiconductor
Addendum
Document Number: QFN_Addendum
Rev. 0, 07/2014
© Freescale Semiconductor, Inc., 2014. All rights reserved.
This addendum provides the changes to the 98A case outline numbers for products covered in this book.
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
the table below for the old (gold wire) package versus the new (copper wire) package.
To view the new drawing, go to Freescale.com and search on the new 98A package number for your
device.
For more information about QFN package use, see EB806: Electrical Connection Recommendations for
the Exposed Pad on QFN and DFN Packages.
Addendum for New QFN
Package Migration
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