百芯智造的价格

3650KG 数据手册 Datasheet - TI

制造商：
TI
分类：
缓冲,放大器,芯片
封装：
CDIP-32
描述：
IC OPAMP ISO 15kHz SGL 32CDIP
文档：

3650KG 数据手册 (14 页)

引脚定义在 3页 Hot

封装外形尺寸在 3页 13页

3650KG 产品设计参考 (18 页)

更新时间： 2023/12/29 08:55:53 (UTC+8)

3650KG 数据手册PDF (14 页)

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3650KG 文档

3650KG 数据手册

14 页, 150 KB

3650KG 产品设计参考

18 页, 782 KB

3650KG 其它数据手册

2 页, 403 KB

3650 数据手册PDF

36502AR33JTDG
数据手册

TE Connectivity

Inductor High Frequency Chip Unshielded Wirewound 330nH 5% 250MHz 48Q-Factor 310mA 1.4Ω DCR 0805 T/R

36502CR47JTDG
数据手册

TE Connectivity

Inductor High Frequency Chip Unshielded Wirewound 470nH 5% 25MHz 45Q-Factor 470mA 1.19Ω DCR 1008 T/R

36502A47NJTDG
数据手册

TE Connectivity

Surface Mount High Frequency Inductor, 36502A Series, 47nH, 5%, 0805 [2012 Metric], 1.65GHz

36502A12NJTDG
数据手册

TE Connectivity

TE CONNECTIVITY 36502A12NJTDG Surface Mount High Frequency Inductor, 36502A Series, 12nH, 5%, 0805 [2012 Metric], 4GHz

36502AR47JTDG
数据手册

TE Connectivity

Surface Mount High Frequency Inductor, 36502A Series, 470nH, 5%, 0805 [2012 Metric], 375MHz

36502CR68JTDG
数据手册

TE Connectivity

Inductor High Frequency Chip Unshielded Wirewound 680nH 5% 25MHz 45Q-Factor 400mA 1.47Ω DCR 1008 T/R

36501E39NJTDG
数据手册

TE Connectivity

Inductor; High Frequency; Ind 0.039uH; Tol 5%; Cur-Rtg 0.2A; SMT; 0402

36501JR27JTDG
数据手册

TE Connectivity

Inductor High Frequency Chip Unshielded Wirewound 270nH 5% 250MHz 25Q-Factor 200mA 2.1Ω DCR 0603 T/R

36501J1N6JTDG
数据手册

TE Connectivity

Inductor High Frequency Chip Unshielded Wirewound 1.6nH 5% 250MHz 16Q-Factor 700mA 40mOhm DCR 0603 T/R

36501JR22JTDG
数据手册

TE Connectivity

Inductor High Frequency Chip Unshielded Wirewound 220nH 5% 250MHz 25Q-Factor 250mA 1.6Ω DCR 0603 T/R

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