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080216
Product Safety Information Datasheet
Material Data and Handling
This should be read in conjunction with the Product Datasheet.
Failure to observe the ratings and the information on this sheet
may result in a safety hazard.
1. Material Content
Solid Tantalum and OxiCap
®
capacitors do not contain
liquid hazardous materials.
The operating section contains:
Tantalum/Niobium Graphite/carbon
Tantalum/Niobium oxide Conducting paint/resins
Manganese dioxide Fluoropolymers (not TAC)
The encapsulation contains:
TAC - epoxy molding compound, solder/tin coated terminal
pads
T
AJ, TMJ, TPS, TPM, TRJ, TRM, TLJ, TLN, TCJ, TCM, TCN, J-CAP
TM
,
TCQ, TCR, TCS, NLJ, NOJ, NOS and NOM - epoxy molding compound,
tin/solder coated terminal pads
THJ - may contain Antimony trioxide and Bromide compounds
as fire retardants.
TAP - solder, solder coated terminal wires, epoxy dipped resin
The capacitors do not contain PBB or PBBO/PBBE. The solder
alloys may contain lead.
2. Physical Form
These capacitors are physically small and are either rectangular
with solderable terminal pads, or cylindrical or bead shaped with
solderable terminal wires.
3. Intrinsic Properties
Operating
Both Tantalum and OxiCap
®
capacitors are polarized devices
and operate satisfactorily in the correct d.c. mode. They will
withstand a limited application of reverse voltage as stated in the
datasheets. However, a reverse application of the rated voltage
will result in early short circuit failure and may result in fire or
explosion. Consequential failure of other associated components
in the circuit e.g. diodes, transformers, etc. may also occur. When
operated in the correct polarity,a long period of satisfactory
operation will be obtained but failure may occur for any of the
following reasons:
• normal failure rate • temperature too high
• surge voltage exceeded • ripple rating exceeded
• reverse voltage exceeded
If this failure mode is a short circuit, the previous conditions
apply. If the adjacent circuit impedance is low, voltage or
current surges may exceed the power handling capability of the
capacitor. For this reason capacitors in circuits of below 1Ω/V
should be derated by minimum 50% for tantalum and 20% for
OxiCap
®
. Precautions should be taken to prevent reverse
voltage spikes. Where capacitors may be subjected to fast
switched, low impedance source voltages, the manufacturers
advice should be sought to determine the most suitable
capacitors for such applications.
Non-operating
Both Tantalum and OxiCap
®
capacitors contain no liquids or
noxious gases to leak out. However, cracking or damage to the
encapsulation may lead to premature failure due to ingress of
material such as cleaning fluids or to stresses transmitted to the
tantalum anode.
4. Fire Characteristics
Primary
Any component subject to abnormal power dissipation may
• self ignite
• become red hot
• break open or explode emitting flaming or red hot
material, solid, molten or gaseous.
Fumes from burning components will vary in composition
depending on the temperature, and should be considered to be
hazardous, although fumes from a single component in a well
ventilated area are unlikely to cause problems.
Secondary
Induced ignition may occur from an adjacent burning or red hot
component. Epoxy resins used in the manufacture of capacitors
give off noxious fumes when burning as stated above. Wherever
possible, capacitors comply with the following:
BS EN 60065
UL 492.60A/280
LOI (ASTM D2863-70) as stated in the datasheets.
5. Storage
AVX Tantalum dielectric chip capacitors are unaffected by the fol-
lowing storage condition for 2 years:
Temperature: -10°C – +50°C
Humidity: 75% RH maximum
Atmospheric pressure: 860 mbar ~ 1060mbar
Tantalum and OxiCap
®
capacitors exhibit a very low random fail-
ure rate after long periods of storage and apart from this there are
no known modes of failure under normal storage conditions. All
capacitors will withstand any environmental conditions within
their ratings for the periods given in the detail specifications.
Storage for longer periods under high humidity conditions may
affect the leakage current of resin protected capacitors.
Solderability of solder coated surfaces may be affected by stor-
age of excess of 2 years. If F-series capacitors should be stored
more than 1 year please contact AVX for advice.
6. Moisture Sensitivity Level
MSL is defined in J-STD-020. It is applicable to non-hermetic
surface mount devices, and is focussed on parts in plastic
packages.
The basic concept is that a plastic package may contain mois-
ture, which can become a high pressure vapour during solder
reflow. If this occurs, the vapor pressure may cause internal
cracking or damage to the device. It can also result in external
steam jets from the package, and these may displace other
nearby components on the circuit board during the solder
process. A common industry reference for this is “popcorning”.
AVX solid tantalum and OxiCap
®
chips which are considered
MSL 1 are molded in plastic packages, and are packaged in
standard packaging, not including a moisture barrier unless
dry pack MSL 3 special option is used (special character V
in part number).
AVX solid electrolyte chips (standard tantalum, conductive
polymer, OxiCap
®
), which are considered MSL 3, MSL 4 or
MSL 5 (ref. product datasheet) are molded in plastic packages,
and are distributed in packaging including a moisture barrier.
