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OMAP3530ECBBALPD 产品设计参考 - TI

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OMAP3530ECBBALPD 产品设计参考

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OMAP3515, OMAP3503
www.ti.com
SPRS505H FEBRUARY 2008REVISED OCTOBER 2013
OMAP3515 and OMAP3503 Applications Processors
Check for Samples: OMAP3515, OMAP3503
1 OMAP3515 and OMAP3503 Applications Processors
1.1 Features
12
256-KB L2 Cache
OMAP3515 and OMAP3503 Devices:
112KB of ROM
OMAP™ 3 Architecture
64KB of Shared SRAM
MPU Subsystem
Endianess:
Up to 720-MHz ARM® Cortex™-A8 Core
ARM Instructions Little Endian
NEON™ SIMD Coprocessor
ARM Data Configurable
PowerVR® SGX™ Graphics Accelerator
(OMAP3515 Device Only) External Memory Interfaces:
Tile-Based Architecture Delivering up to SDRAM Controller (SDRC)
10 MPoly/sec
16- and 32-Bit Memory Controller with
Universal Scalable Shader Engine: Multi- 1GB of Total Address Space
threaded Engine Incorporating Pixel and
Interfaces to Low-Power Double Data
Vertex Shader Functionality
Rate (LPDDR) SDRAM
Industry Standard API Support:
SDRAM Memory Scheduler (SMS) and
OpenGLES 1.1 and 2.0, OpenVG1.0
Rotation Engine
Fine-Grained Task Switching, Load
General Purpose Memory Controller (GPMC)
Balancing, and Power Management
16-Bit-Wide Multiplexed Address and
Programmable High-Quality Image Anti-
Data Bus
Aliasing
Up to 8 Chip-Select Pins with 128-MB
Fully Software-Compatible with ARM9™
Address Space per Chip-Select Pin
Commercial and Extended Temperature
Glueless Interface to NOR Flash, NAND
Grades
Flash (with ECC Hamming Code
ARM Cortex-A8 Core Calculation), SRAM, and Pseudo-SRAM
ARMv7 Architecture Flexible Asynchronous Protocol Control
for Interface to Custom Logic (FPGA,
TrustZone®
CPLD, ASICs, and so forth)
Thumb®-2
Nonmultiplexed Address and Data Mode
MMU Enhancements
(Limited 2-KB Address Space)
In-Order, Dual-Issue, Superscalar
System Direct Memory Access (sDMA)
Microprocessor Core
Controller (32 Logical Channels with
NEON Multimedia Architecture
Configurable Priority)
Over 2x Performance of ARMv6 SIMD
Camera Image Signal Processor (ISP)
Supports Both Integer and Floating-Point
CCD and CMOS Imager Interface
SIMD
Memory Data Input
Jazelle® RCT Execution Environment
BT.601 (8-Bit) and BT.656 (10-Bit) Digital
Architecture
YCbCr 4:2:2 Interface
Dynamic Branch Prediction with Branch
Glueless Interface to Common Video
Target Address Cache, Global History
Decoders
Buffer, and 8-Entry Return Stack
Resize Engine
Embedded Trace Macrocell (ETM) Support
Resize Images From 1/4x to 4x
for Noninvasive Debug
Separate Horizontal and Vertical Control
ARM Cortex-A8 Memory Architecture:
Display Subsystem
16-KB Instruction Cache (4-Way Set-
Associative) Parallel Digital Output
16-KB Data Cache (4-Way Set-Associative) Up to 24-Bit RGB
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
Copyright © 2008–2013, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
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