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S9S12VR64AF0MLC 应用笔记 - NXP

  • 制造商:
    NXP
  • 分类:
    微控制器,MCU,单片机
  • 封装
    LQFP-32
  • 描述:
    MCU 16Bit HCS12 CISC 64KB FLASH 9V/12V/15V AUTOMOTIVE 32Pin LQFP BRICK
更新时间: 2024-08-05 23:09:01 (UTC+8)

S9S12VR64AF0MLC 应用笔记

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Comparison between
MM912_634 and
MC9S12VR Family
by: NXP Semiconductors
1 Introduction
The objective of this application note is to provide a comparison between
these three MCUs, MM912_634, MC9S12VR, and MC9S12VRP. For more
detailed information, please review the reference manual.
The following modules and functionalities are compared in this document:
Clock, Reset and Power Management Unit
Interrupt Module
Debug Module
Current Sense Amplifier Module
Voltage Regulator
Analog-to-Digital Converter Module
Pulse-Width-Modulation Module
Capability to supply external devices as a Hall Sensor
Serial Communication Interface
High-Side Drivers
Low-Side Drivers
LIN Physical Layer
High Voltage Inputs
Timer Module
Battery Sense Module
2 Overview
These three MCU can be used in relay-driven motor control applications. The following table presents a quick comparison
of the main differences between MM12_634, MC9S12VRP, and MC9S12VR. The complete comparison of these modules
are described in subsequent sections.
Contents
1 Introduction........................................... 1
2 Overview................................................ 1
3 General software and debugging
compatibility........................................2
4 Clock, Reset, and Power
Management Unit (CPMU)..................3
5 Interrupt Module (INT)...........................3
6 Debug Module (DBG)............................ 3
7 Voltage Regulator (VREG).................... 3
8 Current Sense........................................4
9 Pulse-Width-Modulation Module
(PWM)...................................................4
10 Capability to supply external
devices as a Hall Sensor (HALL).......5
11 Analog-to-Digital Converter
(ADC) module .....................................5
12 Serial Communication Interface
(SCI)..................................................... 6
13 High-Side Drivers (HSD)..................... 7
14 High Voltage Inputs (HVI)................... 7
15 Low-Side Drivers (LSD).......................8
16 LIN Physical Layer (LIN PHY)............. 8
17 Timer Module (TIM)..............................9
18 Battery Sense Module......................... 9
19 Package Pinout comparison.............10
20 Revision history.................................11
NXP Semiconductors
Document Number: AN5328
Application Note Rev. 0, September 2016

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