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Product Change Notification - JAON-13OEWI224 (Printer Friendly)
Date: 13 Jan 2016
Notification subject: CCB 1839 Initial Notice: Qualification of CuPdAu wire in selected products of the 40K, 57K, 90K, 120K, 150K, 160K and 200K wafer
technologies available in 28L and 40L PDIP (600 mils) package at MMT.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K, 57K, 90K, 120K,
150K, 160K and 200K wafer technologies available in 28L and 40L PDIP (600 mils) package at MMT assembly site.
Pre Change:
Gold (Au) or Palladium coated copper wire (PdCu) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MMT assembly site MMT assembly site
Wire material Au wire or PdCu wire CuPdAu wire
Die attach material CRM-1064L CRM-1064L
Molding compound material GE800 GE800
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability by qualifying Palladium coated copper with gold flash (CuPdAu) bond wire.
Change Implementation Status:
In Progress
Estimated First Ship Date:
April 20, 2016 (date code: 1616)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Summary Table:
January 2016 February 2016 March 2016 April 2016
WW 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17
Initial PCN Issue
Date
X
Qual Report
Availability
X
Final PCN Issue
Date
X
Implementation
Date
X
Markings to Distinguish Revised from Unrevised Devices:
Traceability code
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Product Change Notification
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON
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13OEWI224
