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NCX2200GF3,132 应用笔记 - NXP

制造商:
NXP
分类:
比较器
封装
XFDFN-6
描述:
Comparator Single R-R I/O 5.5V 6Pin XSON T/R
页面指南:
封装外形尺寸在 12页

焊接温度在 7页

应用领域在 31页

更新时间： 2024-07-27 01:54:21 (UTC+8)

NCX2200GF3,132 应用笔记

页码:/32页

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AN10343

MicroPak soldering information

Rev. 2 — 30 December 2010 Application note

Document information

Info Content

Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale

Package (WLCSP)

Abstract This application note describes evaluation of recommended solder land

patterns for mounting MicroPak packages

页面指南

・封装外形尺寸在 12页
・焊接温度在 7页
・应用领域在 31页

页面指南

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