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© Semiconductor Components Industries, LLC, 2016
May, 2017 − Rev. 8
1 Publication Order Number:
MURA105T3/D
MURA105, SURA8105,
MURA110, NRVUA110V,
SURA8110
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (0.66 V Max @ 1.0 A, T
J
= 150°C)
• NRVUA and SURA8 Prefixes for Automotive and Other
Applications Requiring Unique Site and Control Change
Requirements; AEC−Q101 Qualified and PPAP Capable*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection:
♦ Human Body Model > 4000 V (Class 3)
♦ Machine Model > 400 V (Class C)
Device Package Shipping
†
ORDERING INFORMATION
ULTRAFAST RECTIFIERS
1 AMPERE, 50−100 VOLTS
www.onsemi.com
MURA110T3G SMA
(Pb−Free)
5,000 /
Tape & Reel
MURA105T3G SMA
(Pb−Free)
5, 000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SMA
CASE 403D
MARKING DIAGRAM
U4x
AYWW G
U4x = Specific Device Code
x = A for MURA105T3G, SURA8105T3G
= B for MURA/NRVUA/SURA8110T3G
A = Assembly Location**
Y = Year
WW = Work Week
G = Pb−Free Package
NRVUA110VT3G* SMA
(Pb−Free)
5,000 /
Tape & Reel
SMA
(Pb−Free)
5, 000 /
Tape & Reel
SURA8110T3G* 5,000 /
Tape & Reel
SMA
(Pb−Free)
SURA8105T3G*
**The Assembly Location Code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
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