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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCIMX35SR2CEC
Rev. 9, 08/2010
© Freescale Semiconductor, Inc., 2010. All rights reserved.
IMX35
Ordering Information
See Table 1 on page 3 for ordering information.
Package Information
Plastic Package
Case 5284 17 x 17 mm, 0.8 mm Pitch
1 Introduction
The i.MX353 and the i.MX357 multimedia applications
processors represent the next generation of ARM11
products with the right performance and integration to
address applications within the industrial and consumer
markets for applications such as HMI and display
controllers. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX353 and
i.MX357 devices and referred to singularly throughout
this document as i.MX35 or MCIMX35. The i.MX353
devices do not include a graphics processing unit
(GPU). For information on i.MX35 devices for
automotive applications, please refer to document
number, MCIMX35SR2AEC.
The i.MX35 processor takes advantage of the
ARM1136JF-S™ core running at 532 MHz that is
boosted by a multi-level cache system and integrated
features such as LCD controller, Ethernet, and graphics
acceleration for creating rich user interfaces.
The i.MX35 supports connections to various types of
external memories, such as SDRAM, mobile DDR, and
DDR2, SLC and MCL NAND Flash, NOR Flash and
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional Description and Application Information. . . . . . 4
2.1. Application Processor Domain Overview . . . . . . . . . 5
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3. Advanced Power Management Overview . . . . . . . . 6
2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Signal Descriptions: Special Function Related Pins . . . . 12
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
4.6. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 19
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23
4.9. Module-Level AC Electrical Specifications . . . . . . . 29
5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 130
5.1. MAPBGA Production Package 1568-01, 17 × 17 mm,
0.8 Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
5.2. MAPBGA Signal Assignments . . . . . . . . . . . . . . . 132
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 144
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
i.MX35 Applications
Processors for
Industrial and
Consumer Products
Silicon Revisions 2.0 and 2.1
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