![](https://oss-datasheet.aipcba.com/html/84DC64724C4F50A5D22C9D080B3675DB/bg1.png)
January 2
© 2011 Mi
c
U
Introdu
Most p
o
Coeffici
e
With it
s
measur
e
Tempe
r
Using t
regardi
n
1. M
The N
T
figure 1
Becaus
e
the po
w
module
sink te
m
A
n NT
C
directly;
j
unction
sink th
e
016
c
rosemi Corpor
a
U
sing NT
ction:
o
wer mod
u
e
nt (NTC) t
h
s
low cos
t
e
ments a
n
r
ature Coef
f
he informa
t
n
g safety c
o
odule inte
r
T
C thermist
o
).
e
of negligi
w
er module
is in gene
r
m
perature.
C
thermisto
r
it would
n
temperatu
e
rmal resist
a
a
tion
C Temp
e
u
les includ
e
h
ermistor
w
t
, the NT
C
n
d ove
r
-te
m
f
icient) resi
s
t
ion from t
h
o
nsideratio
n
r
nal struct
u
o
r is locate
Fig
1
ble self-he
a
case.
A
lso
r
al very sm
a
r
can never
n
eed to be
re can be
e
a
nce, as wil
e
rature s
Pierre
-
R
Microsemi
26 r
33 5
2
e
a tempe
r
w
ith resistan
C
thermisto
m
perature
s
tors are pr
e
h
e temper
a
n
s within th
e
u
re.
d close to
1
: NTC ther
m
a
ting, the N
T
, since the
a
ll, the me
a
be used to
integrated
e
stimated b
a
l be shown.
ensor in
t
-
Laurent Do
R
&D Engin
e
Power Mo
d
ue de Cam
p
2
0 Bruges,
r
ature sen
s
ce that dec
r
r
is the d
protection,
e
ferable for
a
ture sens
o
e
equipmen
t
the power
m
istor loca
t
T
C thermis
t
case to h
e
a
sured tem
p
monitor th
e
in the po
w
a
sed on th
e
t
egrated
umergue
e
er
d
ule Produ
c
p
illeau
France
s
or. Usuall
y
reases whil
evice of
c
but othe
r
specific te
m
o
r is easy,
t
.
dice, on th
t
ion on a su
t
o
r
remains
e
at-sink the
r
p
erature is
a
e
junction t
e
w
er die, wh
e
NTC ther
m
into po
w
c
ts
y
it is a N
e
e temperat
u
c
hoice for
r
devices
m
perature c
o
but some
e same ce
bstrate
at almost
s
r
mal resist
a
a
ssumed t
o
e
mperature
ich is not
t
m
istor tem
p
A
pplic
a
w
er mod
u
e
gative Te
m
u
re increas
e
module te
m
like PTC
o
ntrol appli
c
care must
ramic subs
s
ame temp
e
a
nce R
CS
o
o
be close t
o
of the pow
e
t
he case h
p
erature an
d
a
tion Note
1
u
le
m
perature
e
s.
m
perature
(Positive
c
ations.
be taken
s
trate (see
e
rature as
o
f a power
o
the heat
e
r devices
ere. The
d
case-to-
APT0406